Iron Soldering Pot Manufacturer - National Solbot Electronics Industrial Co., Ltd.

This Point-Soldering Machine, made of thick cast iron, is designed especially for high temp. soldering up to 300oC.

It is suitable for soldering transformers, DE soldering for through hole components, connector etc.

The flow nozzle can be changed when a partial soldering or removing. There is no need to clean away the dioxides during operation. Special flow nozzles can be made required.

Point Soldering Machine Features

Solder pot material is made of special casting iron.
Duct and nozzle is made of SUS 316L.
Nozzle can be customized.
Solder wave height can be adjusted.
Time of flow wave can be set.
Temperature is controlled by PID and SSR.
Two methods of flow waves: continuous and time-controlled.
Work bench is anti static electricity.

Spec.	Model: 120 F
Power Req.	AC 220V 1phase
Consumption	3 kw
Solder Capacity	16 kg
Flow Wave Motor	25 W
Operating Temp.	300Â°C
Warm-up Time	Approx 30 min (250Â°C)
Volume	615x260x300 mm
Net Weight	30 kg

Main construction: lnlet Belt Conveyor, Foaming Fluxer, Pre-heater, Single Wave(C250-SW) or Daul Wave Soldering(C250-DW) Bath, Finger Chain Conveyor, Control System


	Inlet rail conveyor		Pre-heatering: 420mm length

	Single bath-250C-SW Double bath--250C-DW Cast iron,high-temp. solder pot visible in this photo.		Built-in, easy-to-use control panel Pre-heater ON/OFF Switch Pre-heater Temp. Controller Solder Pot Heater ON/OFF Switch Solder Pot Temp. Controller Wave ON/OFF Switch Wave Height Setting Knob Conveyor ON/OFF Switch Conveyor Speed Setting Knob Safety Device Emergency Stop Switch Button

	Foam Fluxer system The spray volume and pressure can be adjusted for each PCB's		High Temp. Engineering fiber finger & Finger Chain conveyor Finger conveyor eliminates the expense and time cost of using pallets and will not wear out from the high temperatures required for lead-free solders

	Quickly raise and lower the conveyor, or roll the solder pot in or out.		Built –in Cleaning work frame for easy access to the high-temperature cast solder pot.

	Option: PLC control system		Option: Drun Spray Fluxer

1.	Adjust Handle of Finger width (pcb width)
2.	Spray Volume Controller
3.	Emergency Switch
4.	Weekly Timer
5.	Handle of Solder Pot Roll IN/Out
6.	Adjust Handle of Rail Angle
7.	Touch Pannel Controller
8.	Soder Pot Wave Controller
9.	Conveyor Speed Controller
10.	Exhaust Pipe for Spray Fluxer
11.	Exhaust Connector for Spray Fluxer
12.	Exhaust Connector for Solder Pot

C250 Series wave solder machine is available with dual waves for mixed technology (through-hole + SMT) processing or with a single wave for through-hole only. Stand is included. It has everything you need to get started with lead-free solders: high-temp finger conveyor, foam fluxer, 16.5" of preheating power, high-temp solder pot, built-in controls, and stand.

An upgrade to spray fluxer and touch-screen computer control is also available.

Finger conveyor eliminates the expense and time cost of using pallets and will not wear out from the high temperatures required for lead-free solders. Heating coils and cast, high-temperature solder pot also visible.

A rear panel drops open, allowing the supporting legs, shown folded for storage (L), to deploy, allowing the panel to open for convenient and easy access to the high-temperature cast solder pot.

The upgraded model of the 250C includes a spray flux unit (shown here with its vent) in addition to the foam fluxer, and a PC with touch-screen controls.

The upgraded 250C, with door open, showing the optional touch-screen computer controller (right). Below the touch-screen are the conveyor speed adjuster and the solder pot wave adjuster.

Turning the removable handle (L) manually controls the position of the solder pot once the rear door is opened, allowing easy access for cleaning and maintenance.

The finger conveyor (R, inlet with the adjust handle below), accepts differing board widths. It can be easily raised or lowered by means of the manual wheel under the rail (L) at the other end.

Model	C250-SW Single wave	C250C-DW Double wave	C250-PLC Doubel wave+Spray Fluxer
Power requirement	3φ220V, 50/60Hz ( Voltage: upon request)
Energy consumption	7.65KVA		7.7KVA
Compress Air	5kg/cm², 5 CFM	5kg/cm², 5 CFM	5kg/cm², 25 CFM
Conveyor angle	3-6^o Adjustable
Conveyor speed	Max.1.6M/min, /2.0M/min(50/60Hz)
Fluxing style	Foaming fluxer		Spray Fluxer
Fluxer capacity	3.0 liter		300c.c.
Size of PCB	30 ~ 250mm
Pre-heater zone length	420mm
Pre-heater consumption	2.4kw (0.8kw x 3)
Solder pot max. working temp.	300^oC
Solder capacity	100kg		98kg
Solder pot power consumption	5.1KW
Heating method of solder pot	Indirect heating method
Solder wave type	single wave		Double wave
Solder wave height	10mm Max.
Main wave Motor	60W		90W
Main conveyor motor	40W
Main conveyor finger	L Type, High Temp. Fiber Finger
Outline dimension (Incldue Standard Frame H: 300mm	1960 x830 x1,275mm (exclude warning light)		2,020x830x1,505mm (include warning light)
Net Weight including Stand	448KG	460KG	470KG

Low-Volume, Seamless Solder Pot Loads Easily and Carries Three-Year Warranty
C250 Wave Soldering Systems feature a high-efficiency, low-volume solder pot and corrosion-resistant wave pumping system. Developed in conjunction with some of our closest customers, the initial start-up cost for solder when using the C250 is approximately two-thirds to half the cost of competitive equipment. Our high-efficiency heaters and small, 100 kg (220 lb.) volume considerably decrease start-up time and consume much less energy, but more importantly reduce oxidation and dross formation. The specially-coated, solid cast-iron solder pot has a seamless construction and includes a three-year replacement warranty. The solder pot and wave assembly easily slide out from the rear of the unit onto an extendable platform and are braced by heavy-duty supporting legs during loading and maintenance

Available in Either Single- or Dual-Wave Configuration
The C250 is supplied as standard in a single-wave configuration for conventional through-hole assemblies, but for minimal additional cost can also be supplied as a dual-wave system for surface mount and mixed technology boards. Dual-wave technology often provides improved hole penetration and reduced bridging on difficult-to-solder boards of all technologies and therefore makes the dual-wave configuration very popular. If necessary, the chip wave in dual-wave systems can easily be deactivated through the installation of a nozzle cover plate included with this option. Wave height control is dial-adjustable to a maximum height setting of 10 mm (.39") and the wave pump motor, with on/off control activated by optical board sensors on the conveyor, is also protected by low temperature and overheat alarms.

Adjustable Fiber-Finger Conveyor and IR Preheater Allow Precise Lead-Free Profiling
The C250 Wave Soldering System includes a high-temperature, corrosion-resistant, fiber-finger conveyor system with variable speed up to 2 m/min (79"/min). Conveyor angle (3°-6°) and width are easily-adjustable to accommodate PCBs from 30 mm to 250 mm (1.2" to 10"). A chain-driven, pin-type inlet conveyor is included as standard and allows easy loading of assemblies and smooth transfer into the conveyor fingers.
After flux application, a 420 mm IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes.

Innovative Drum-Spray Fluxing System Provides Benefits of Both Spray and Foam Methods

A reliable, easy-to-use foam fluxing system is included with the standard C250 and provides extremely consistent, maintenance-free performance over extended periods. For assemblers looking for even greater precision, the C250 can also be purchased with our optional "drum-spray" fluxing system. Drum-Spray Fluxing Technology is designed to deliver the precision of spray fluxing through a simple, innovative design that is easier to set up and maintain, and less costly to operate than other spraying methods. As shown in the diagram below, the Drum-Spray nozzle is positioned as close to the bottom of the PCB as possible and precisely applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than systems that utilize small nozzles mounted to a reciprocating motor drive below the PCB. An adjustable mask is used to control the width of the spray pattern and optical sensors provide on/off control of the spray mechanism.