National Solbot Electronics Industrial Co., Ltd.

No. 66, Alley 6, Lane 315, Chung Cheng N. Rd.,
San-Chung Area,
New Taipei City, Taiwan

Tel: 886-2-29894951  
Fax: 886-2-29853119

E-mail: solbot@solbotwave.com

 

 

 

 

 




C250 Lead Free Soldering Machine - Compact Design, Low Operation Cost

Low-Volume, Seamless Solder Pot Loads Easily and Carries Three-Year Warranty
C250 Wave Soldering Systems feature a high-efficiency, low-volume solder pot and corrosion-resistant wave pumping system. Developed in conjunction with some of our closest customers, the initial start-up cost for solder when using the C250 is approximately two-thirds to half the cost of competitive equipment. Our high-efficiency heaters and small, 100 kg (220 lb.) volume considerably decrease start-up time and consume much less energy, but more importantly reduce oxidation and dross formation. The specially-coated, solid cast-iron solder pot has a seamless construction and includes a three-year replacement warranty. The solder pot and wave assembly easily slide out from the rear of the unit onto an extendable platform and are braced by heavy-duty supporting legs during loading and maintenance


Available in Either Single- or Dual-Wave Configuration
The C250 is supplied as standard in a single-wave configuration for conventional through-hole assemblies, but for minimal additional cost can also be supplied as a dual-wave system for surface mount and mixed technology boards. Dual-wave technology often provides improved hole penetration and reduced bridging on difficult-to-solder boards of all technologies and therefore makes the dual-wave configuration very popular. If necessary, the chip wave in dual-wave systems can easily be deactivated through the installation of a nozzle cover plate included with this option. Wave height control is dial-adjustable to a maximum height setting of 10 mm (.39") and the wave pump motor, with on/off control activated by optical board sensors on the conveyor, is also protected by low temperature and overheat alarms.



Adjustable Fiber-Finger Conveyor and IR Preheater Allow Precise Lead-Free Profiling
The C250 Wave Soldering System includes a high-temperature, corrosion-resistant, fiber-finger conveyor system with variable speed up to 2 m/min (79"/min). Conveyor angle (3°-6°) and width are easily-adjustable to accommodate PCBs from 30 mm to 250 mm (1.2" to 10"). A chain-driven, pin-type inlet conveyor is included as standard and allows easy loading of assemblies and smooth transfer into the conveyor fingers.
After flux application, a 420 mm IR preheater uses stainless-steel sheath-type heaters to raise PCBs and components to manufacturers' recommended temperatures for proper activation of VOC-Free and Lead-Free fluxes.


Innovative Drum-Spray Fluxing System Provides Benefits of Both Spray and Foam Methods
A reliable, easy-to-use foam fluxing system is included with the standard C250 and provides extremely consistent, maintenance-free performance over extended periods. For assemblers looking for even greater precision, the C250 can also be purchased with our optional "drum-spray" fluxing system. Drum-Spray Fluxing Technology is designed to deliver the precision of spray fluxing through a simple, innovative design that is easier to set up and maintain, and less costly to operate than other spraying methods. As shown in the diagram below, the Drum-Spray nozzle is positioned as close to the bottom of the PCB as possible and precisely applies flux in a thin vertical knife pattern across the full width of the board as it passes over the rotating drum. This method has been shown to provide more uniform application and less flux waste than systems that utilize small nozzles mounted to a reciprocating motor drive below the PCB. An adjustable mask is used to control the width of the spray pattern and optical sensors provide on/off control of the spray mechanism.